2026/08/31
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3D Architech攜手工研院亮相SEMICON Taiwan 10微米GMM技術搶攻AI資料中心液冷市場
【台北訊】隨著生成式AI快速發展，GPU與AI加速器功率密度持續攀升，資料中心散熱與能源效率已成為全球科技產業的重要課題。創新金屬製造技術公司 3D Architech 於 SEMICON Taiwan 與工業技術研究院（工研院）共同展示最新高效能 微流道冷板（Microchannel Cold Plate），以自主開發的 Gel-to-Metal Manufacturing（GMM） 技術，實現最低達 10微米（μm）解析度的複雜三維金屬微結構，瞄準快速成長的AI資料中心直接液冷（Direct Liquid Cooling, DLC）市場。
在AI資料中心中，冷卻系統的能源消耗最高可占整體用電量約40%；隨著高功率AI晶片快速普及，傳統空冷技術逐漸接近效率極限。3D Architech所開發的微流道冷板，透過冷板內部精密的三維微流道循環冷卻液，更有效率地將晶片產生的熱能導出。
GMM技術的核心優勢，在於能製造傳統加工難以實現的 3D lattice-based microchannel（三維晶格微流道），並依據不同晶片的熱分布進行最佳化設計。3D Architech的三維晶格微流道相較傳統skived microchannels，可實現約 21%的熱阻降低，展現其應用於高功率AI晶片散熱的潛力。
此外，GMM可實現最低 10 μm尺度特徵，約為人類頭髮寬度的十分之一，使高度複雜的微流道與三維晶格設計成為可能。 除超高解析度外，GMM亦具備複雜三維結構設計、低製造成本與高速成型等優勢，目標同時滿足高性能與未來規模化量產需求。
針對AI資料中心應用，3D Architech可進一步依據晶片熱分布客製化流道，使冷卻能力集中於高熱通量區域。依公司目前技術評估與開發目標，透過冷板最佳化設計與GMM製程整合，冷卻能源消耗最高具降低達60%的潛力，協助資料中心提升能源使用效率。
此次與工研院共同於SEMICON Taiwan展示，也象徵3D Architech進一步鏈結台灣半導體與AI伺服器產業生態系。公司以 「Revolutionizing Metal Manufacturing for Energy Efficiency」 為願景，目前已布局美國波士頓、日本仙台與台灣台北，未來將持續與半導體、伺服器、散熱及資料中心產業夥伴合作，加速GMM技術與新一代液冷方案走向全球市場。
歡迎於 SEMICON Taiwan 展會期間蒞臨 3D Architech 攤位（南港展覽館1館4樓 Booth No. L0700），現場了解 GMM 技術與新一代 AI 晶片微流道液冷解決方案。
SEMICON Taiwan 展會資訊
3D Architech / 攤位號碼：南港展覽館1館4樓 Booth No. L0700
媒體／商務聯絡人
David Chang｜Business Development
3D Architech
dchang@3d-architech.com
3D Architech Joins ITRI at SEMICON Taiwan to Showcase 10-Micron GMM Technology for AI Data Center Liquid Cooling
TAIPEI, Taiwan — As generative AI drives unprecedented growth in computing power, rising GPU and AI accelerator power densities are creating major thermal-management challenges for data centers. At SEMICON Taiwan, 3D Architech, together with Taiwan’s Industrial Technology Research Institute (ITRI), is showcasing its high-performance Microchannel Cold Plate, enabled by the company’s proprietary Gel-to-Metal Manufacturing (GMM) technology.
Designed for Direct Liquid Cooling (DLC) in AI data centers, GMM enables complex three-dimensional metallic microstructures with features as fine as 10 microns (μm), creating new possibilities for high-performance cooling beyond the limitations of conventional manufacturing.
Cooling systems account for approximately up to 40% of electricity consumption in AI data centers. As AI chip power density continues to increase, conventional air cooling is approaching practical limits. 3D Architech’s cold plate circulates coolant through precisely engineered internal microchannels, efficiently transferring heat away from high-power processors.
A key advantage of GMM is its ability to manufacture sophisticated 3D lattice-based microchannels that can be optimized according to chip-level heat distribution.The company’s lattice-based microchannel achieved approximately a 21% reduction in thermal resistance compared with conventional skived microchannels.
GMM also enables features as fine as 10 μm—approximately one-tenth the width of a human hair—allowing intricate microchannels and lattice geometries that are difficult to achieve through conventional metal manufacturing. Combined with lower manufacturing cost and high-speed forming capabilities, GMM is designed to address both high-performance requirements and future scalable production.
For AI data center applications, 3D Architech can further optimize cold-plate structures based on the thermal profile of individual chips. Based on the company’s current technology assessment and development targets, optimized cold plates integrated with GMM have the potential to reduce cooling-related energy consumption by up to 60%.
The joint showcase with ITRI at SEMICON Taiwan marks an important step in connecting 3D Architech with Taiwan’s semiconductor and AI server ecosystem. Under its vision of “Revolutionizing Metal Manufacturing for Energy Efficiency,” the company has established a presence in Boston, Sendai and Taipei, and plans to expand collaboration with semiconductor, server, thermal-management and data center partners worldwide.
Visit 3D Architech at SEMICON Taiwan, Booth L0700 @ TaiNEX1,4F, to explore our proprietary GMM technology and next-generation microchannel liquid cooling solutions for AI chips.
SEMICON Taiwan
3D Architech Booth: L0700 @ TaiNEX1,4F
Media / Business Contact
David Chang｜Business Development
3D Architech
dchang@3d-architech.com
