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Article Title Samsung, TSMC, and Micron Top List of IC Industry Capacity Leaders
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A ranking of the industry’s 10 largest IC manufacturers in terms of installed capacity is provided in Figure 1. Included in the list are four from North America, two companies from South Korea, two from Taiwan, and one each from Europe and Japan.

As of December 2013, Samsung had the most installed wafer capacity with nearly 1.9 million 200mm-equivalent wafers per month!  That represented 12.6% of the world’s total capacity and most of it used for the fabrication of DRAM and flash memory devices.  Next in line was the largest pure-play foundry in the world TSMC with about 1.5 million wafers per month capacity, or 10.0% of total worldwide capacity.  Following TSMC were memory IC suppliers Micron, Toshiba/SanDisk, and SK Hynix.

In January 2013, Micron and Nanya amended their Inotera partnership such that Micron now takes 95% of Inotera’s wafer output.  Previously, Micron and Nanya evenly split Inotera’s capacity.  Then, in July 2013, Micron finally closed the deal on its acquisition of Elpida Memory and the Rexchip business in Taiwan that Elpida operated in partnership with Powerchip.  It took Micron a full year to complete the purchase after several delays with getting approvals from bondholders and governments.  With the addition of the Elpida and Rexchip fabs as well as the extra Inotera capacity, Micron became the third-largest wafer capacity holder in the world in 2013 with nearly 1.4 million 200mm-equivalent wafers per month (9.3% of total worldwide capacity).  At the end of 2012, Micron had the sixth-largest amount of wafer capacity.

The fourth-largest capacity holder at the end of 2013 was Toshiba with a little under 1.2 million in monthly wafer capacity (8.0% of total worldwide capacity), including a substantial amount of flash memory capacity for joint-investor/partner SanDisk.  After Toshiba came another memory IC supplier SK Hynix with a little more than one million wafers/month (7.0% of total worldwide capacity).  Rounding out the top six companies was Intel with 961K 200mm-equivalent wafers per month capacity, or 6.5% of total worldwide capacity.  Just two years ago in 2011, Intel was the third-largest capacity leader, but in early 2012 the company reduced its ownership position in IM Flash as well as its wafer output share from its joint venture with Micron.

Category: Industry News
Date: 2014/01/08
Link: http://www.icinsights.com/news/bulletins/Samsung-TSMC-And-Micron-Top-List-Of-IC-Industry-Capacity-Leaders/
Source: IC Insight
Attachment: [2013 Wafer Capacity Ranking.pdf]

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